(2026). A Thermal Model with the Capability of Characterizing Thermal Coupling Effects for Multi-Chip Power Modules. CPSS Transactions on Power Electronics and Applications.
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Chicago Style (17th ed.) Citation
"A Thermal Model with the Capability of Characterizing Thermal Coupling Effects for Multi-Chip Power Modules."
CPSS Transactions on Power Electronics and Applications 2026.
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MLA (9th ed.) Citation
"A Thermal Model with the Capability of Characterizing Thermal Coupling Effects for Multi-Chip Power Modules."
CPSS Transactions on Power Electronics and Applications, 2026.
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Warning: These citations may not always be 100% accurate.