(2025). Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders. Modern Electronic Materials.
Successfully copied to clipboard
Copying to clipboard failed
Chicago Style (17th ed.) Citation
"Investigation of the Adhesive Properties of Composites Based on Polyimide Varnish and Copper Oxide, Boron Nitride and Technical Diamond Powders."
Modern Electronic Materials 2025.
Successfully copied to clipboard
Copying to clipboard failed
MLA (9th ed.) Citation
"Investigation of the Adhesive Properties of Composites Based on Polyimide Varnish and Copper Oxide, Boron Nitride and Technical Diamond Powders."
Modern Electronic Materials, 2025.
Successfully copied to clipboard
Copying to clipboard failed
Warning: These citations may not always be 100% accurate.