APA (7th ed.) Citation
(2024). Mushroom Mycelium Foam Cushioning Properties in Protective Packaging Application. Journal of Applied Packaging Research.
Chicago Style (17th ed.) Citation
"Mushroom Mycelium Foam Cushioning Properties in Protective Packaging Application." Journal of Applied Packaging Research 2024.
MLA (9th ed.) Citation
"Mushroom Mycelium Foam Cushioning Properties in Protective Packaging Application." Journal of Applied Packaging Research, 2024.
Warning: These citations may not always be 100% accurate.