APA (7th ed.) Citation
(2026). Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules. IEEE Open Journal of Power Electronics.
Chicago Style (17th ed.) Citation
"Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules." IEEE Open Journal of Power Electronics 2026.
MLA (9th ed.) Citation
"Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules." IEEE Open Journal of Power Electronics, 2026.
Warning: These citations may not always be 100% accurate.