(2026). Thermal Management and Experimental Validation of a Copper-Inlay PCB for SiC MOSFETs in High-Power EV Fast Chargers. IEEE Open Journal of Power Electronics.
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Chicago Style (17th ed.) Citation
"Thermal Management and Experimental Validation of a Copper-Inlay PCB for SiC MOSFETs in High-Power EV Fast Chargers."
IEEE Open Journal of Power Electronics 2026.
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MLA (9th ed.) Citation
"Thermal Management and Experimental Validation of a Copper-Inlay PCB for SiC MOSFETs in High-Power EV Fast Chargers."
IEEE Open Journal of Power Electronics, 2026.
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Warning: These citations may not always be 100% accurate.