APA (7th ed.) Citation
(2026). 3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC. IET Power Electronics.
Chicago Style (17th ed.) Citation
"3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC." IET Power Electronics 2026.
MLA (9th ed.) Citation
"3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC." IET Power Electronics, 2026.
Warning: These citations may not always be 100% accurate.