APA (7th ed.) Citation
(2025). CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES. Facta Universitatis Series: Mechanical Engineering.
Chicago Style (17th ed.) Citation
"CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES." Facta Universitatis Series: Mechanical Engineering 2025.
MLA (9th ed.) Citation
"CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES." Facta Universitatis Series: Mechanical Engineering, 2025.
Warning: These citations may not always be 100% accurate.