APA (7th ed.) Citation
(2026). Packaging of W-Band Power Amplifier Modules Using Waveguide-Microstrip Line Transition Feeds and High-Isolation Power Combiners. IEEE Access.
Chicago Style (17th ed.) Citation
"Packaging of W-Band Power Amplifier Modules Using Waveguide-Microstrip Line Transition Feeds and High-Isolation Power Combiners." IEEE Access 2026.
MLA (9th ed.) Citation
"Packaging of W-Band Power Amplifier Modules Using Waveguide-Microstrip Line Transition Feeds and High-Isolation Power Combiners." IEEE Access, 2026.
Warning: These citations may not always be 100% accurate.