APA (7th ed.) Citation
(2026). An Early‐Stage Bond Wire Lift‐Off Defect Identification Method Based on Surface Temperature Rise Characteristics. IET Power Electronics.
Chicago Style (17th ed.) Citation
"An Early‐Stage Bond Wire Lift‐Off Defect Identification Method Based on Surface Temperature Rise Characteristics." IET Power Electronics 2026.
MLA (9th ed.) Citation
"An Early‐Stage Bond Wire Lift‐Off Defect Identification Method Based on Surface Temperature Rise Characteristics." IET Power Electronics, 2026.
Warning: These citations may not always be 100% accurate.