(2026). Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection. IEEE Access.
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Chicago Style (17th ed.) Citation
"Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection."
IEEE Access 2026.
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MLA (9th ed.) Citation
"Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection."
IEEE Access, 2026.
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Warning: These citations may not always be 100% accurate.