The influence of prior creep damage on the fracture localisation in X20 CrMoV12-1 cross-weld creep tests by Rasiawan, Trisha

“…The as-received base materials were subjected to different operating conditions hence contain different degrees of creep damage. The microstructural evaluation of the creep damaged material was conducted using optical microscopy, scanning electron microscopy (SEM), coupled with more advanced electron backscattered diffraction (EBSD). …”
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X-ray micro-computed tomography (μCT) evaluation of bubble structure to determine quality of dough and bread made from roasted wheat flour by Germishuys, Zandre

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