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A study of copper diffusion through Pd₂Si thin films
It is now generally recognized that unless an alternative for aluminium is found the resistivity of the metal interconnects will soon limit device performance. Copper, with its low resistivity and greater resistance to electromigration is one of the obvious substitutes. However, before aluminium can...
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| Format: | Thesis |
| Language: | English |
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Department of Physics
2016
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