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Substrate curvature measurement system
Industry often requires, in a variety of processes, the measurement of deformation induced in a solid object by mechanical stress. One such process is during the manufacture of very large scale integrated circuits (VLSI). During this process a substrate is coated with a thin film to protect the micr...
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| Format: | Thesis |
| Language: | English |
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Department of Electrical Engineering
2016
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| _version_ | 1867613299544162304 |
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| access_status_str | Open Access |
| author | Groenewald, Ben |
| author2 | Tapson, Jonathan |
| author_browse | Groenewald, Ben Tapson, Jonathan |
| author_facet | Tapson, Jonathan Groenewald, Ben |
| author_sort | Groenewald, Ben |
| collection | Thesis |
| description | Industry often requires, in a variety of processes, the measurement of deformation induced in a solid object by mechanical stress. One such process is during the manufacture of very large scale integrated circuits (VLSI). During this process a substrate is coated with a thin film to protect the micro circuitry formed on the substrate. Due to the differences in thermal expansions between film and substrate, mechanical stresses can develop which may lead to deformation of the substrate surface. Any deformation of the substrate surface will result in mechanical stress in the interconnections of the circuitry, which could result in severe damage to the operation of the circuit. Different measurement techniques are available to measure the spherical deformation of substrates, with the latest known technique being a combination of a laser beam deflection and light scattering techniques. Many of the existing techniques reveal shortcomings, one of which is a 2-dimensional scanning capability with a minimum of moving components. Another shortcoming is the incapability of previous techniques to calculate the relative error which the measuring technique induces into the results. The aim of this study has been to develop an electro-optical system embodying the successful principles of these techniques in a system which will eliminate the shortcomings and produce results in excess of those previously recorded. In this work, we have concentrated on discussing the development of a system which will produce in situ real time monitoring of mechanical stresses in a solid. The system includes the minimization of system induced errors through the calculation of error voltage gains, and the introduction of a 2-dimensional scanning capability to determine the true position of the laser beam without prior knowledge of the initial substrate curvature. A four-quadrant position sensitive detector (PSD) with relevant Lab View software and programs were also introduced into the system. |
| format | Thesis |
| id | oai:open.uct.ac.za:11427/19376 |
| institution | University of Cape Town (South Africa) |
| language | eng |
| last_indexed | 2026-06-10T12:33:55.830Z |
| license_str | Not specified — see source repository |
| provenance_str_mv | Harvested via OAI-PMH from UCTD — University of Cape Town Open Access Repository |
| publishDate | 2016 |
| publishDateRange | 2016 |
| publishDateSort | 2016 |
| publisher | Department of Electrical Engineering |
| publisherStr | Department of Electrical Engineering |
| record_format | dspace |
| source_str | UCTD — University of Cape Town Open Access Repository |
| spelling | oai:open.uct.ac.za:11427/19376 Substrate curvature measurement system Groenewald, Ben Tapson, Jonathan Electrical Engineering Industry often requires, in a variety of processes, the measurement of deformation induced in a solid object by mechanical stress. One such process is during the manufacture of very large scale integrated circuits (VLSI). During this process a substrate is coated with a thin film to protect the micro circuitry formed on the substrate. Due to the differences in thermal expansions between film and substrate, mechanical stresses can develop which may lead to deformation of the substrate surface. Any deformation of the substrate surface will result in mechanical stress in the interconnections of the circuitry, which could result in severe damage to the operation of the circuit. Different measurement techniques are available to measure the spherical deformation of substrates, with the latest known technique being a combination of a laser beam deflection and light scattering techniques. Many of the existing techniques reveal shortcomings, one of which is a 2-dimensional scanning capability with a minimum of moving components. Another shortcoming is the incapability of previous techniques to calculate the relative error which the measuring technique induces into the results. The aim of this study has been to develop an electro-optical system embodying the successful principles of these techniques in a system which will eliminate the shortcomings and produce results in excess of those previously recorded. In this work, we have concentrated on discussing the development of a system which will produce in situ real time monitoring of mechanical stresses in a solid. The system includes the minimization of system induced errors through the calculation of error voltage gains, and the introduction of a 2-dimensional scanning capability to determine the true position of the laser beam without prior knowledge of the initial substrate curvature. A four-quadrant position sensitive detector (PSD) with relevant Lab View software and programs were also introduced into the system. 2016-05-04T07:37:22Z 2016-05-04T07:37:22Z 1999 Master Thesis Masters MSc http://hdl.handle.net/11427/19376 eng application/pdf Department of Electrical Engineering Faculty of Engineering and the Built Environment University of Cape Town |
| spellingShingle | Electrical Engineering Groenewald, Ben Substrate curvature measurement system |
| thesis_degree_str | Master's |
| title | Substrate curvature measurement system |
| title_full | Substrate curvature measurement system |
| title_fullStr | Substrate curvature measurement system |
| title_full_unstemmed | Substrate curvature measurement system |
| title_short | Substrate curvature measurement system |
| title_sort | substrate curvature measurement system |
| topic | Electrical Engineering |
| url | http://hdl.handle.net/11427/19376 |
| work_keys_str_mv | AT groenewaldben substratecurvaturemeasurementsystem |