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Development of a thermal analysis tool for superconducting circuits

Thesis (MEng)--Stellenbosch University, 2021.

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Main Author: Venter, Bernard
Other Authors: Fourie, Coenrad
Format: Thesis
Language:en_ZA
Published: Stellenbosch : Stellenbosch University 2021
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access_status_str Open Access
author Venter, Bernard
author2 Fourie, Coenrad
author_browse Fourie, Coenrad
Venter, Bernard
author_facet Fourie, Coenrad
Venter, Bernard
author_sort Venter, Bernard
collection Thesis
dc_rights_str_mv Stellenbosch University
description Thesis (MEng)--Stellenbosch University, 2021.
format Thesis
id oai:scholar.sun.ac.za:10019.1/109888
institution Stellenbosch University (South Africa)
language en_ZA
last_indexed 2026-06-10T12:43:43.080Z
license_str Other — see source repository
provenance_str_mv Harvested via OAI-PMH from SUNScholar — Stellenbosch University Repository
publishDate 2021
publishDateRange 2021
publishDateSort 2021
publisher Stellenbosch : Stellenbosch University
publisherStr Stellenbosch : Stellenbosch University
record_format dspace
source_str SUNScholar — Stellenbosch University Repository
spelling oai:scholar.sun.ac.za:10019.1/109888 Development of a thermal analysis tool for superconducting circuits Venter, Bernard Fourie, Coenrad Stellenbosch University. Faculty of Engineering. Dept. of Electrical and Electronic Engineering. Thermal analysis Superconducting generators Heat transfer -- Simulation UCTD Thesis (MEng)--Stellenbosch University, 2021. ENGLISH ABSTRACT: Unforeseen heat generation or propagation adversely affects superconducting integrated circuits. The excess heat interferes with the performance of circuit elements sensitive to temperature, such as the Josephson junction (JJ). Research shows the increasing density of circuit elements due to the growing integration scale of superconducting circuits. The study aims to create a thermal analysis tool to simulate the heat propagation through a superconductor circuit before fabrication. The tool was created by deriving the thermal conductivity of superconducting metals, developing a finite element model of the structure, and simulating the heat propagation iteratively for a set of test conditions. The primary factors limiting the operation of the simulation is the assumption of zero magnetic field and perfect thermal contact. The heat transfer simulation through a Josephson Transmission Line (JTL) circuit demonstrated the operation of the thermal analysis tool. The thermal analysis performed on the JTL examined the effect an increasing bias current had on the surrounding area. The simulation showed a minimal temperature increase in the Josephson junction due to heat dissipated by the bias resistor. The large temperature increase was localised around the bias resistor. The thermal analysis tool successfully simulated the heat dissipation through a superconducting circuit for different test cases. AFRIKAANSE OPSOMMING: Onvoorsiene opwekking of verspreiding van hitte beïnvloed die supergeleidende geïntegreerde stroombane nadelig. Die oormatige hitte belemmer die werking van stroombaan elemente wat temperatuur sensitief is soos die Josephson junction (JJ). Navorsing toon aan die toenemende digtheid van stroombaan elemente as gevolg van die groeiende integrasie skaal van super geleidende stroombane. Die studie het ten doel om ’n instrument vir termiese analise te skep om die hitte-verspreiding deur ’n super geleier stroombaan te simuleer voordat dit vervaardig word. Die instrument is geskep deur die termiese geleidingsvermoë van super geleidende metale af te lei, ’n eindige element model van die struktuur te ontwikkel en die hitte-voortplanting iteratief te simuleer vir ’n stel toets omstandighede. Die primêre faktore wat die werking van die simulasie beperk, is die aanname van nul-magnetiese veld en perfekte termiese kontak. Die hitte-oordrag-simulasie deur ’n Josephson Transmission Line (JTL) stroombaan het die werking van die termiese analise instrument gedemonstreer. Die termiese analise wat op die JTL uitgevoer is, het die effek van ’n toenemende vooroordeel stroom op die omgewing ondersoek. Die simulasie het ’n minimale temperatuurtoename in die Josephson junction getoon as gevolg van hitte wat deur die vooroordeel resistor versprei word. Die groot temperatuurverhoging is gelokaliseer rondom die vooroordeel resistor. Die termiese analise instrument het die hitte-afvoer suksesvol gesimuleer deur ’n super geleidende stroombaan vir verskillende toetsgevalle. Masters 2021-02-17T07:41:22Z 2021-04-21T14:30:30Z 2021-02-17T07:41:22Z 2021-04-21T14:30:30Z 2021-03 Thesis http://hdl.handle.net/10019.1/109888 en_ZA Stellenbosch University 125 pages application/pdf Stellenbosch : Stellenbosch University
spellingShingle Thermal analysis
Superconducting generators
Heat transfer -- Simulation
UCTD
Venter, Bernard
Development of a thermal analysis tool for superconducting circuits
title Development of a thermal analysis tool for superconducting circuits
title_full Development of a thermal analysis tool for superconducting circuits
title_fullStr Development of a thermal analysis tool for superconducting circuits
title_full_unstemmed Development of a thermal analysis tool for superconducting circuits
title_short Development of a thermal analysis tool for superconducting circuits
title_sort development of a thermal analysis tool for superconducting circuits
topic Thermal analysis
Superconducting generators
Heat transfer -- Simulation
UCTD
url http://hdl.handle.net/10019.1/109888
work_keys_str_mv AT venterbernard developmentofathermalanalysistoolforsuperconductingcircuits