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Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films

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Published in:Modern Electronic Materials
Format: Online Article RSS Article
Published: 2023
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container_title Modern Electronic Materials
description
discipline_display Technology & Engineering
discipline_facet Technology & Engineering
format Online Article
RSS Article
genre Journal Article
id rss_article:12771
institution FRELIP
journal_source_facet Modern Electronic Materials
publishDate 2023
publishDateSort 2023
record_format rss_article
spellingShingle Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films
Manufacturing and Technology
Technology & Engineering — Computing
Technology & Engineering
sub_discipline_display Technology & Engineering — Computing
sub_discipline_facet Technology & Engineering — Computing
subject_display Manufacturing and Technology
Technology & Engineering — Computing
Technology & Engineering
Manufacturing and Technology
Technology & Engineering — Computing
Technology & Engineering
subject_facet Manufacturing and Technology
Technology & Engineering — Computing
Technology & Engineering
title Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films
title_auth Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films
title_full Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films
title_fullStr Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films
title_full_unstemmed Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films
title_short Electron and hole injection barriers between silicon substrate and RF magnetron sputtered In2O3 : Er films
title_sort electron and hole injection barriers between silicon substrate and rf magnetron sputtered in2o3 : er films
topic Manufacturing and Technology
Technology & Engineering — Computing
Technology & Engineering
url https://moem.pensoft.net/article/109980/