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Can Electro-Mechanical Stress Enable Effective Majority Logic Implementations?

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Bibliographic Details
Published in:IEEE Open Journal of Nanotechnology
Format: Online Article RSS Article
Published: 2026
Subjects:
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_version_ 1867301674866966531
collection WordPress RSS
FRELIP Feed Integration
container_title IEEE Open Journal of Nanotechnology
description
discipline_display Manufacturing and Technology
discipline_facet Manufacturing and Technology
format Online Article
RSS Article
genre Journal Article
id rss_article:63412
institution FRELIP
journal_source_facet IEEE Open Journal of Nanotechnology
publishDate 2026
publishDateSort 2026
record_format rss_article
spellingShingle Can Electro-Mechanical Stress Enable Effective Majority Logic Implementations?
Manufacturing and Technology
General
Manufacturing and Technology
sub_discipline_display General
sub_discipline_facet General
subject_display Manufacturing and Technology
General
Manufacturing and Technology
Manufacturing and Technology
General
Manufacturing and Technology
subject_facet Manufacturing and Technology
General
Manufacturing and Technology
title Can Electro-Mechanical Stress Enable Effective Majority Logic Implementations?
title_auth Can Electro-Mechanical Stress Enable Effective Majority Logic Implementations?
title_full Can Electro-Mechanical Stress Enable Effective Majority Logic Implementations?
title_fullStr Can Electro-Mechanical Stress Enable Effective Majority Logic Implementations?
title_full_unstemmed Can Electro-Mechanical Stress Enable Effective Majority Logic Implementations?
title_short Can Electro-Mechanical Stress Enable Effective Majority Logic Implementations?
title_sort can electro-mechanical stress enable effective majority logic implementations?
topic Manufacturing and Technology
General
Manufacturing and Technology
url http://ieeexplore.ieee.org/document/11372983