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Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders

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Published in:Modern Electronic Materials
Format: Online Article RSS Article
Published: 2025
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container_title Modern Electronic Materials
description
discipline_display Manufacturing and Technology
discipline_facet Manufacturing and Technology
format Online Article
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genre Journal Article
id rss_article:63519
institution FRELIP
journal_source_facet Modern Electronic Materials
publishDate 2025
publishDateSort 2025
record_format rss_article
spellingShingle Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders
Manufacturing and Technology
General
Manufacturing and Technology
sub_discipline_display General
sub_discipline_facet General
subject_display Manufacturing and Technology
General
Manufacturing and Technology
Manufacturing and Technology
General
Manufacturing and Technology
subject_facet Manufacturing and Technology
General
Manufacturing and Technology
title Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders
title_auth Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders
title_full Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders
title_fullStr Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders
title_full_unstemmed Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders
title_short Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders
title_sort investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders
topic Manufacturing and Technology
General
Manufacturing and Technology
url https://moem.pensoft.net/article/143013/