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Development and Evaluation of SiC LDMOS for High-Temperature Applications

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Bibliographic Details
Published in:IEEE Journal of the Electron Devices Society
Format: Online Article RSS Article
Published: 2025
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container_title IEEE Journal of the Electron Devices Society
description
discipline_display Electronics
discipline_facet Electronics
format Online Article
RSS Article
genre Journal Article
id rss_article:74168
institution FRELIP
journal_source_facet IEEE Journal of the Electron Devices Society
last_indexed 2026-06-20T21:31:51.751Z
publishDate 2025
publishDateSort 2025
record_format rss_article
spellingShingle Development and Evaluation of SiC LDMOS for High-Temperature Applications
Electronics
General
Electronics
sub_discipline_display General
sub_discipline_facet General
subject_display Electronics
General
Electronics
subject_facet Electronics
General
Electronics
title Development and Evaluation of SiC LDMOS for High-Temperature Applications
title_alt Desarrollo y evaluación de LDMOS de SiC para aplicaciones de alta temperatura
Développement et évaluation du LDMOS SiC pour applications à haute température
Desenvolvimento e Avaliação de SiC LDMOS para Aplicações de Alta Temperatura
title_auth Development and Evaluation of SiC LDMOS for High-Temperature Applications
title_es_txt Desarrollo y evaluación de LDMOS de SiC para aplicaciones de alta temperatura
title_fr_txt Développement et évaluation du LDMOS SiC pour applications à haute température
title_full Development and Evaluation of SiC LDMOS for High-Temperature Applications
title_fullStr Development and Evaluation of SiC LDMOS for High-Temperature Applications
title_full_unstemmed Development and Evaluation of SiC LDMOS for High-Temperature Applications
title_pt_txt Desenvolvimento e Avaliação de SiC LDMOS para Aplicações de Alta Temperatura
title_short Development and Evaluation of SiC LDMOS for High-Temperature Applications
title_sort development and evaluation of sic ldmos for high-temperature applications
topic Electronics
General
Electronics
url http://ieeexplore.ieee.org/document/11271727