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Multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading
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| Published in: | Archive of Applied Mechanics |
|---|---|
| Format: | Online Article RSS Article |
| Published: |
2026
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| Subjects: | |
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| _version_ | 1868553618772197377 |
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| collection | WordPress RSS FRELIP Feed Integration |
| container_title | Archive of Applied Mechanics |
| description | |
| discipline_display | Computer Science |
| discipline_facet | Computer Science |
| format | Online Article RSS Article |
| genre | Journal Article |
| id | rss_article:77981 |
| institution | FRELIP |
| journal_source_facet | Archive of Applied Mechanics |
| last_indexed | 2026-06-20T21:39:49.249Z |
| publishDate | 2026 |
| publishDateSort | 2026 |
| record_format | rss_article |
| spellingShingle | Multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading Computer Science General Computer Science |
| sub_discipline_display | General |
| sub_discipline_facet | General |
| subject_display | Computer Science General Computer Science |
| subject_facet | Computer Science General Computer Science |
| title | Multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading |
| title_alt | Análisis de vibración acoplada multicampo de cascarones cilíndricos piezoeléctricos semiconductores sándwich bajo carga térmica Analyse vibratoire couplée multi-champs de coques cylindriques piézoélectriques semi-conductrices sandwich sous charge thermique Análise de vibração acoplada multicampo de cascas cilíndricas sanduíche piezoelétricas semicondutoras sob carga térmica |
| title_auth | Multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading |
| title_es_txt | Análisis de vibración acoplada multicampo de cascarones cilíndricos piezoeléctricos semiconductores sándwich bajo carga térmica |
| title_fr_txt | Analyse vibratoire couplée multi-champs de coques cylindriques piézoélectriques semi-conductrices sandwich sous charge thermique |
| title_full | Multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading |
| title_fullStr | Multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading |
| title_full_unstemmed | Multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading |
| title_pt_txt | Análise de vibração acoplada multicampo de cascas cilíndricas sanduíche piezoelétricas semicondutoras sob carga térmica |
| title_short | Multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading |
| title_sort | multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading |
| topic | Computer Science General Computer Science |
| url | https://link.springer.com/article/10.1007/s00419-026-03093-6 |