Full Text Available
Note: Clicking the button above will open the full text document at the original institutional repository in a new window.
A Thermal Model with the Capability of Characterizing Thermal Coupling Effects for Multi-Chip Power Modules
Saved in:
| Published in: | CPSS Transactions on Power Electronics and Applications |
|---|---|
| Format: | Online Article RSS Article |
| Published: |
2026
|
| Subjects: | |
| Tags: |
No Tags, Be the first to tag this record!
|
| _version_ | 1870116498980208640 |
|---|---|
| collection | WordPress RSS FRELIP Feed Integration |
| container_title | CPSS Transactions on Power Electronics and Applications |
| description | |
| discipline_display | Energy |
| discipline_facet | Energy |
| format | Online Article RSS Article |
| genre | Journal Article |
| id | rss_article:100407 |
| institution | FRELIP |
| journal_source_facet | CPSS Transactions on Power Electronics and Applications |
| last_indexed | 2026-07-08T03:41:13.485Z |
| publishDate | 2026 |
| publishDateSort | 2026 |
| record_format | rss_article |
| spellingShingle | A Thermal Model with the Capability of Characterizing Thermal Coupling Effects for Multi-Chip Power Modules Energy General Energy |
| sub_discipline_display | General |
| sub_discipline_facet | General |
| subject_display | Energy General Energy |
| subject_facet | Energy General Energy |
| title | A Thermal Model with the Capability of Characterizing Thermal Coupling Effects for Multi-Chip Power Modules |
| title_alt | Un modelo térmico con capacidad de caracterizar efectos de acoplamiento térmico para módulos de potencia multichip Un modèle thermique capable de caractériser les effets de couplage thermique pour les modules de puissance multi-puces Um modelo térmico com capacidade de caracterizar efeitos de acoplamento térmico para módulos de potência multi-chip |
| title_auth | A Thermal Model with the Capability of Characterizing Thermal Coupling Effects for Multi-Chip Power Modules |
| title_es_txt | Un modelo térmico con capacidad de caracterizar efectos de acoplamiento térmico para módulos de potencia multichip |
| title_fr_txt | Un modèle thermique capable de caractériser les effets de couplage thermique pour les modules de puissance multi-puces |
| title_full | A Thermal Model with the Capability of Characterizing Thermal Coupling Effects for Multi-Chip Power Modules |
| title_fullStr | A Thermal Model with the Capability of Characterizing Thermal Coupling Effects for Multi-Chip Power Modules |
| title_full_unstemmed | A Thermal Model with the Capability of Characterizing Thermal Coupling Effects for Multi-Chip Power Modules |
| title_pt_txt | Um modelo térmico com capacidade de caracterizar efeitos de acoplamento térmico para módulos de potência multi-chip |
| title_short | A Thermal Model with the Capability of Characterizing Thermal Coupling Effects for Multi-Chip Power Modules |
| title_sort | a thermal model with the capability of characterizing thermal coupling effects for multi-chip power modules |
| topic | Energy General Energy |
| url | http://ieeexplore.ieee.org/document/11495429 |