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Mushroom Mycelium Foam Cushioning Properties in Protective Packaging Application

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Bibliographic Details
Published in:Journal of Applied Packaging Research
Format: Online Article RSS Article
Published: 2024
Subjects:
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collection WordPress RSS
FRELIP Feed Integration
container_title Journal of Applied Packaging Research
description
discipline_display Technology & Engineering
discipline_facet Technology & Engineering
format Online Article
RSS Article
genre Journal Article
id rss_article:22690
institution FRELIP
journal_source_facet Journal of Applied Packaging Research
publishDate 2024
publishDateSort 2024
record_format rss_article
spellingShingle Mushroom Mycelium Foam Cushioning Properties in Protective Packaging Application
Plastics
Technology & Engineering — Aerospace & Applied Tech
Technology & Engineering
sub_discipline_display Technology & Engineering — Aerospace & Applied Tech
sub_discipline_facet Technology & Engineering — Aerospace & Applied Tech
subject_display Plastics
Technology & Engineering — Aerospace & Applied Tech
Technology & Engineering
Plastics
Technology & Engineering — Aerospace & Applied Tech
Technology & Engineering
subject_facet Plastics
Technology & Engineering — Aerospace & Applied Tech
Technology & Engineering
title Mushroom Mycelium Foam Cushioning Properties in Protective Packaging Application
title_auth Mushroom Mycelium Foam Cushioning Properties in Protective Packaging Application
title_full Mushroom Mycelium Foam Cushioning Properties in Protective Packaging Application
title_fullStr Mushroom Mycelium Foam Cushioning Properties in Protective Packaging Application
title_full_unstemmed Mushroom Mycelium Foam Cushioning Properties in Protective Packaging Application
title_short Mushroom Mycelium Foam Cushioning Properties in Protective Packaging Application
title_sort mushroom mycelium foam cushioning properties in protective packaging application
topic Plastics
Technology & Engineering — Aerospace & Applied Tech
Technology & Engineering
url https://repository.rit.edu/japr/vol16/iss1/3