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Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules
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| Published in: | IEEE Open Journal of Power Electronics |
|---|---|
| Format: | Online Article RSS Article |
| Published: |
2026
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| Subjects: | |
| Tags: |
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| _version_ | 1864030190940717060 |
|---|---|
| collection | WordPress RSS FRELIP Feed Integration |
| container_title | IEEE Open Journal of Power Electronics |
| description | |
| discipline_display | Environmental Sciences |
| discipline_facet | Environmental Sciences |
| format | Online Article RSS Article |
| genre | Journal Article |
| id | rss_article:30553 |
| institution | FRELIP |
| journal_source_facet | IEEE Open Journal of Power Electronics |
| publishDate | 2026 |
| publishDateSort | 2026 |
| record_format | rss_article |
| spellingShingle | Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules — — — — — Energy Environmental Management Environmental Sciences |
| sub_discipline_display | Environmental Management |
| sub_discipline_facet | Environmental Management |
| subject_display | — — — — — Energy Environmental Management Environmental Sciences — — — — — Energy Environmental Management Environmental Sciences |
| subject_facet | — — — — — Energy Environmental Management Environmental Sciences |
| title | Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules |
| title_auth | Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules |
| title_full | Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules |
| title_fullStr | Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules |
| title_full_unstemmed | Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules |
| title_short | Overview of Thermal Modeling and Monitoring for SiC Multi-Chip Power Modules |
| title_sort | overview of thermal modeling and monitoring for sic multi-chip power modules |
| topic | — — — — — Energy Environmental Management Environmental Sciences |
| url | http://ieeexplore.ieee.org/document/11397526 |