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3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC

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Bibliographic Details
Published in:IET Power Electronics
Format: Online Article RSS Article
Published: 2026
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container_title IET Power Electronics
description
discipline_display Environmental Sciences
discipline_facet Environmental Sciences
format Online Article
RSS Article
genre Journal Article
id rss_article:30635
institution FRELIP
journal_source_facet IET Power Electronics
publishDate 2026
publishDateSort 2026
record_format rss_article
spellingShingle 3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC
— — — — — Energy
Environmental Management
Environmental Sciences
sub_discipline_display Environmental Management
sub_discipline_facet Environmental Management
subject_display — — — — — Energy
Environmental Management
Environmental Sciences
— — — — — Energy
Environmental Management
Environmental Sciences
subject_facet — — — — — Energy
Environmental Management
Environmental Sciences
title 3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC
title_auth 3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC
title_full 3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC
title_fullStr 3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC
title_full_unstemmed 3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC
title_short 3D Lumped Thermal Model for Compliant Press‐Pack IGBT Submodule in MMC
title_sort 3d lumped thermal model for compliant press‐pack igbt submodule in mmc
topic — — — — — Energy
Environmental Management
Environmental Sciences
url https://ietresearch.onlinelibrary.wiley.com/doi/10.1049/pel2.70214?af=R