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CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES
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| Published in: | Facta Universitatis Series: Mechanical Engineering |
|---|---|
| Format: | Online Article RSS Article |
| Published: |
2025
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| Subjects: | |
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| _version_ | 1864030189854392323 |
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| collection | WordPress RSS FRELIP Feed Integration |
| container_title | Facta Universitatis Series: Mechanical Engineering |
| description | |
| discipline_display | Engineering & Technology |
| discipline_facet | Engineering & Technology |
| format | Online Article RSS Article |
| genre | Journal Article |
| id | rss_article:3578 |
| institution | FRELIP |
| journal_source_facet | Facta Universitatis Series: Mechanical Engineering |
| publishDate | 2025 |
| publishDateSort | 2025 |
| record_format | rss_article |
| spellingShingle | CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES — — — — — Mechanical Engineering Mechanical Engineering Engineering & Technology |
| sub_discipline_display | Mechanical Engineering |
| sub_discipline_facet | Mechanical Engineering |
| subject_display | — — — — — Mechanical Engineering Mechanical Engineering Engineering & Technology — — — — — Mechanical Engineering Mechanical Engineering Engineering & Technology |
| subject_facet | — — — — — Mechanical Engineering Mechanical Engineering Engineering & Technology |
| title | CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES |
| title_auth | CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES |
| title_full | CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES |
| title_fullStr | CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES |
| title_full_unstemmed | CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES |
| title_short | CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES |
| title_sort | cu-cu mechanical bonding for 3d integration of the next generation electronic chips: interfacial mechanisms, surface engineering, and emerging low-temperature strategies |
| topic | — — — — — Mechanical Engineering Mechanical Engineering Engineering & Technology |
| url | https://casopisi.junis.ni.ac.rs/index.php/FUMechEng/article/view/14015 |