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Packaging of W-Band Power Amplifier Modules Using Waveguide-Microstrip Line Transition Feeds and High-Isolation Power Combiners
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| Published in: | IEEE Access |
|---|---|
| Format: | Online Article RSS Article |
| Published: |
2026
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| Subjects: | |
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| _version_ | 1864030192800890880 |
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| collection | WordPress RSS FRELIP Feed Integration |
| container_title | IEEE Access |
| description | |
| discipline_display | Technology & Engineering |
| discipline_facet | Technology & Engineering |
| format | Online Article RSS Article |
| genre | Journal Article |
| id | rss_article:45795 |
| institution | FRELIP |
| journal_source_facet | IEEE Access |
| publishDate | 2026 |
| publishDateSort | 2026 |
| record_format | rss_article |
| spellingShingle | Packaging of W-Band Power Amplifier Modules Using Waveguide-Microstrip Line Transition Feeds and High-Isolation Power Combiners Computer Sciience Technology & Engineering — Computing Technology & Engineering |
| sub_discipline_display | Technology & Engineering — Computing |
| sub_discipline_facet | Technology & Engineering — Computing |
| subject_display | Computer Sciience Technology & Engineering — Computing Technology & Engineering Computer Sciience Technology & Engineering — Computing Technology & Engineering |
| subject_facet | Computer Sciience Technology & Engineering — Computing Technology & Engineering |
| title | Packaging of W-Band Power Amplifier Modules Using Waveguide-Microstrip Line Transition Feeds and High-Isolation Power Combiners |
| title_auth | Packaging of W-Band Power Amplifier Modules Using Waveguide-Microstrip Line Transition Feeds and High-Isolation Power Combiners |
| title_full | Packaging of W-Band Power Amplifier Modules Using Waveguide-Microstrip Line Transition Feeds and High-Isolation Power Combiners |
| title_fullStr | Packaging of W-Band Power Amplifier Modules Using Waveguide-Microstrip Line Transition Feeds and High-Isolation Power Combiners |
| title_full_unstemmed | Packaging of W-Band Power Amplifier Modules Using Waveguide-Microstrip Line Transition Feeds and High-Isolation Power Combiners |
| title_short | Packaging of W-Band Power Amplifier Modules Using Waveguide-Microstrip Line Transition Feeds and High-Isolation Power Combiners |
| title_sort | packaging of w-band power amplifier modules using waveguide-microstrip line transition feeds and high-isolation power combiners |
| topic | Computer Sciience Technology & Engineering — Computing Technology & Engineering |
| url | http://ieeexplore.ieee.org/document/11488036 |