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Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection
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| Published in: | IEEE Access |
|---|---|
| Format: | Online Article RSS Article |
| Published: |
2026
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| _version_ | 1864030190570569731 |
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| collection | WordPress RSS FRELIP Feed Integration |
| container_title | IEEE Access |
| description | |
| discipline_display | Engineering & Technology |
| discipline_facet | Engineering & Technology |
| format | Online Article RSS Article |
| genre | Journal Article |
| id | rss_article:8316 |
| institution | FRELIP |
| journal_source_facet | IEEE Access |
| publishDate | 2026 |
| publishDateSort | 2026 |
| record_format | rss_article |
| spellingShingle | Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection Computer Science & Information Science Computer Science & IT Engineering & Technology |
| sub_discipline_display | Computer Science & IT |
| sub_discipline_facet | Computer Science & IT |
| subject_display | Computer Science & Information Science Computer Science & IT Engineering & Technology Computer Science & Information Science Computer Science & IT Engineering & Technology |
| subject_facet | Computer Science & Information Science Computer Science & IT Engineering & Technology |
| title | Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection |
| title_auth | Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection |
| title_full | Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection |
| title_fullStr | Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection |
| title_full_unstemmed | Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection |
| title_short | Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection |
| title_sort | improving electrical and thermal performance of 650-v gan e-hemt modules using a cover-all meandered thick-copper (camt) interconnection |
| topic | Computer Science & Information Science Computer Science & IT Engineering & Technology |
| url | http://ieeexplore.ieee.org/document/11366226 |